Today’s cloud data centers are tasked with processing an astonishing 5 trillion gigabytes of data annually. As millions of new users join the cloud ecosystem and IoT devices proliferate, this demand is expected to grow exponentially in the coming years. To keep up, cloud data centers must continue reducing costs while scaling to accommodate massive growth. MACOM’s End Face Etching Technology (EFT) is set to revolutionize optical interconnects in these environments, enabling significant breakthroughs in both cost efficiency and mass production.
To meet the rising bandwidth demands, cloud data centers are rapidly adopting 100G optical interconnects and preparing for the transition to 200G, 400G, and beyond. However, current 100G solutions come with high costs that limit their widespread adoption. Despite this, telecom providers have long demonstrated that investing in 100G technology is a strategic move that pays off over time. As a result, cloud operators typically upgrade their networks every three to five years, gradually increasing capacity while managing costs.
MACOM has developed advanced EFT technology and possesses the manufacturing scale necessary to support large-scale deployment. This gives them a strong edge in the cloud data center market, similar to how they dominated the PON (Passive Optical Network) sector. The PON market, which relies heavily on DFB lasers, is highly sensitive to both capacity and cost—making it an ideal proving ground for cost-effective laser solutions.
With EFT, MACOM has already delivered over 200 million sub-10G lasers for PON applications, capturing more than 70% market share in 2016. Applying the same manufacturing capabilities to cloud data centers, MACOM is well-positioned to produce up to 10 million units, extending its cost leadership into a much larger and more demanding market.
EFT improves manufacturing efficiency by leveraging wafer-level processes, overcoming the limitations of traditional cut-end technology (CFT). CFT involves mechanical cutting, which can introduce defects and reduce yield. In contrast, EFT uses precise chemical etching, minimizing defects and boosting throughput. This leads to lower manufacturing costs and more reliable optical components.
In addition, EFT enables full-temperature testing at the wafer level, eliminating the need for costly and time-consuming post-packaging tests. This process also allows for better alignment and higher optical coupling efficiency—up to 80%, compared to just 50% with CFT.
MACOM’s 25G laser portfolio for 100G cloud applications leverages EFT’s advantages, combining cost-efficiency with high performance. Drawing from its experience in the PON market, MACOM ensures competitive pricing and capacity, reinforcing its position as a leader in the industry.
Looking ahead, MACOM is pushing further by integrating EFT into silicon photonic integrated circuits (PICs). Their L-PICâ„¢ technology combines lasers, modulators, and multiplexers on a single chip, enabling high-speed, high-density optical interconnects. This innovation addresses the challenges of aligning lasers with silicon chips, using a self-aligned process that eliminates the need for manual alignment and significantly reduces costs.
By eliminating hermetic packaging, EFT lasers also allow for smaller, more compact modules, improving interconnect density and system performance. These advancements position MACOM to lead the next wave of optical innovation in cloud data centers.
With its proven EFT technology, IP protection, and scalable manufacturing, MACOM is breaking down barriers to silicon PIC adoption. Their L-PIC series is scheduled to begin volume shipments in Q2 2017, marking a major milestone in the evolution of high-speed, energy-efficient optical interconnects.
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