TSMC's 10nm process has now surpassed Intel, marking a significant shift in the semiconductor industry. According to recent reports, Intel’s 10nm technology is expected to be delayed until the second half of 2017. If it manages to start mass production by year-end, it could still lag behind TSMC by one or two quarters. This delay has allowed TSMC to take the lead in the race for advanced chip manufacturing.
In recent years, the competition among the "Semiconductor Triad"—Intel, TSMC, and Samsung—has intensified, with Intel traditionally holding the top position. However, as each company advances its processes, they gain the ability to secure major orders from top clients like Apple, Qualcomm, and MediaTek. The next big battle in this race will center around the 10nm process.
Although Intel hasn’t officially confirmed its 10nm progress, sources like The Motley Fool have reported that Intel plans to launch its first 10nm products in the second half of 2017. Meanwhile, TSMC is on track to begin mass production of 10nm chips this year, potentially giving it a full year’s advantage over Intel.
Intel's roadmap includes three key product lines: the Cannonlake series in 2017, Icelake in 2018, and Tigerlake in 2019. Looking further ahead, Intel expects its 7nm chips to be available in 2020, with 5nm technology possibly reaching the market in 2022.
On the other hand, TSMC has been making rapid strides. Its 16nm process has already gained significant traction, outpacing Samsung. TSMC’s chairman, Mark Liu, emphasized during a recent conference that the company aims to maintain a strong market share in the future. This signals not only a lead over Samsung in nanometer processes but also a potential overtaking of Intel at the 10nm level.
TSMC’s co-CEO, David Liu, confirmed that the company is advancing both its 10nm and 7nm processes. TSMC has already achieved a high trial production rate for 10nm and completed the first 7nm static random-access memory (SRAM) production in Q1 of this year. Full product design is expected by early 2018, with main production based in Zhongke.
TSMC’s process advancements have also benefited MediaTek, one of the first customers to adopt 10nm. While Qualcomm has shifted to Samsung and Spreadtrum relies on Intel, MediaTek has consistently chosen TSMC for its advanced nodes. This strategic move gives MediaTek a competitive edge in the mobile chip market.
Previously, MediaTek planned to use TSMC’s 16nm process this year. However, due to delays in Samsung’s 14nm production and increased demand for high-end mobile chips, MediaTek decided to skip the 16nm node and go directly to 10nm. The company is now focusing heavily on its 10nm Helio X30 project, which is set to ship samples by year-end and enter mass production early next year.
With TSMC’s 10nm process leading the way, MediaTek’s upcoming chips will be able to compete more effectively with industry leaders like Qualcomm and Spreadtrum. This should help MediaTek secure flagship models from major phone manufacturers and improve its average selling price (ASP).
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