TSMC's 10nm process has surpassed Intel, marking a significant shift in the semiconductor industry. According to recent reports, Intel's 10nm manufacturing technology is expected to be delayed until the second half of 2017. If it manages to start mass production by year-end, it will still lag behind TSMC by one or two quarters. This delay highlights the growing competition among the top players in the semiconductor space—Intel, TSMC, and Samsung.
In recent years, these three giants have been locked in a fierce race for leadership in advanced chip manufacturing. Historically, Intel has been the front-runner, but now, with TSMC gaining ground, the balance of power is shifting. TSMC's ability to secure major orders from key clients like Apple, Qualcomm, and MediaTek shows its increasing influence in the market.
The battle for the next generation of chip technology is now focused on the 10nm process. While Intel has not officially confirmed the exact timeline for its 10nm products, sources like The Motley Fool suggest that Intel plans to launch its first 10nm chips in the second half of 2017. Meanwhile, TSMC aims to complete mass production of its 10nm chips this year, potentially putting it ahead by up to a year.
Intel’s roadmap includes three product lines based on 10nm technology: the Cannonlake series in 2017, Icelake in 2018, and Tigerlake in 2019. Looking further ahead, Intel is expected to introduce 7nm chips in 2020 and possibly reach 5nm by 2022.
Meanwhile, TSMC has made impressive progress. Its 16nm process has gained significant traction this year, outpacing Samsung. TSMC's chairman, Mark Liu, emphasized that the company aims to maintain a strong market share in the future, signaling confidence in its position as a leader in advanced manufacturing. This includes not only overtaking Samsung in the nanometer race but also surpassing Intel at the 10nm stage.
TSMC's co-CEO, Liu Deyin, mentioned that the company is advancing both its 10nm and 7nm processes. TSMC has already achieved initial success in 7nm static random-access memory (SRAM) production and plans to complete product design by early 2018, with main production based in Zhongke.
This technological leap benefits companies like MediaTek, one of the first wave of 10nm customers. MediaTek competes directly with Qualcomm and Spreadtrum, with Qualcomm turning to Samsung and Spreadtrum relying on Intel. However, MediaTek has consistently chosen TSMC for its advanced process needs.
Previously, MediaTek planned to use TSMC’s 16nm process this year, but due to delays and increased demand for high-end mobile chips, the company decided to skip 16nm entirely and target 10nm instead. The "Helio X30" project, now under 10nm, is expected to begin sampling with customers by year-end and enter mass production in early 2018.
With TSMC's 10nm process leading the way, MediaTek’s upcoming 10nm chips will be able to compete with those of industry leaders like Qualcomm and Spreadtrum. This positions MediaTek to capture more premium smartphone models and improve its average selling price (ASP), strengthening its competitive edge in the market.
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