Wearable devices, due to size and weight limitations, are more demanding on chip size and power consumption than mobile devices, so component developers such as microcontrollers (MCUs), microprocessors (MPUs) and microelectromechanical systems (MEMS) sensors A new generation of solutions with lower power consumption or high integration has been launched, and it is possible to wear wearable electronic business opportunities.
Wearables will ignite a new round of chip hotspots. Wearable devices are limited by size and weight. The required component specifications are different from those of general mobile devices. In order to grab this business opportunity, the key component developers in wearable devices are all committed to launching a new generation of low-cost devices for wearable devices. A power-hungry or highly integrated solution that re-engineers mobile device component specifications.
Figure 1 Raman Sharma, director of regional marketing for the US core laboratory, said that the primary consideration in the design of wearable products is whether the components can reach the level of ultra-low power consumption.
Raman Sharma (Figure 1), director of marketing for the US regional market at Silicon Labs, said that from the feedback from developers of wearable devices such as Misfit or Magellan, the most important thing to pay attention to when designing wearable products is Components are not enough power, they emphasize that long battery life is the key to whether wearable products are acceptable to consumers and successful in the market; therefore, wearable device developers often choose low power consumption. The controller (MCU) acts as the core of the device processing to extend battery life.
In order to meet the low power consumption requirements of most wearable devices, MCU manufacturers, in addition to minimizing the system standby and operating current, are also trying to optimize the power consumption of the MCU in sleep state, which will become the success of the MCU factory. An important indicator of grabbing the wearable market.
Meet the wearable application MCU factory to fight low power design
Figure 2 Lin Renlie, associate director of the product center of Xintang Technology Microcontroller, pointed out that in addition to minimizing system standby and operating current, MCU manufacturers are also striving to optimize the power consumption of the MCU in sleep state.
Lin Renlie (Fig. 2), assistant director of the product center of Nuvoton Microcontroller, said that in order to achieve ultra-low power performance, manufacturers usually introduce sleep mode (Sleep Mode) design when developing MCU, so that MCU is in the peak of non-system operation. For most of the period, it can be in a low-power sleep state, further reducing the overall power consumption of the device.
Lin Renlie further pointed out that low-power MCUs that meet the needs of wearable devices must operate at current levels below 180 microamperes (μA), and standby currents in sleep mode must be less than 1 microamperes; however, when MCUs When in sleep mode, the system is not completely still. Therefore, how to optimize the system design of the MCU in sleep mode and make the device more power-saving has become a major focus of MCU manufacturers' efforts.
Among them, the fast wake-up time is the most important key. It is understood that in order to achieve energy-saving purposes, MCU manufacturers often add various operating modes to the MCU. There may be several types of sleep modes. For example, Atmel's SAM4L series can support sleep. Four sleep modes: standby, save, and standby. In a variety of complex modes of operation, it is difficult to really reduce system power consumption if the MCU always takes a long time to boot from sleep mode. Therefore, Lin Renlie mentioned that in addition to the introduction of sleep mode design, MCU vendors also pay great attention to how to accelerate the wake-up time. It is understood that the average performance level of MCUs on the market today is about 5-8 milliseconds (ms).
On the other hand, the transmission interface between the MCU and peripheral sensors and radio frequency (RF) components also determines whether the MCU can achieve an effective sleep mode. Lin Renlie explained that because the operation mode of the MCU and peripheral components in the sleep mode changes with the data transmission speed, that is, the faster the data transmission speed, the shorter the time for the MCU to wake up/work mode switching between the peripheral components; therefore, The design of the serial interface (SPI), I2C, input/output (I/O) pins, etc. is designed to “grab fastâ€. The faster the high-speed transmission interface can wake up the MCU and shorten the time for the MCU to process data. To make the device more power efficient.
Lin Renlie added that more and more low-power and high-performance MCUs are now being introduced, and multi-channel Direct Memory Access (DMA) controllers that speed up memory access speeds are also being introduced. Execute and assign data access without waking up the MCU. That is to say, the DMA controller can store multiple data distributions into static random access memory (SRAM) and flash memory (Flash), and wake up the MCU after the memory is stored to a certain capacity. Handling multiple data, so that the MCU entering sleep mode will not be easily disturbed.
In addition, MCU developers have designed the Low Energy Sensor Interface (LESENSE) and Peripheral Reflection System (PRS) to improve the performance of the MCU in sleep mode; Optimize these two designs to develop an ultra-low-power MCU--EFM32 Gecko; even if the MCU enters sleep mode, the peripheral components of the MCU, such as an analog-to-digital converter (ADC), can also self-pair, autonomously capture and transmit data.
It is worth mentioning that in addition to the low-power MCUs built on the core of the ARM Cortex-M series, the market for wearable devices is becoming more popular, and some manufacturers will adopt microprocessors built with the Cortex-A series ( MPU) Imports wearables, enabling wearables to achieve higher-level application functionality.
Locking the high-end wearable product MPU program outcrop
Wang Wei, Marketing and Business Development Manager, Asia Pacific, Freescale Microcontroller Division believes that the design focus of wearable devices is on the functional aspects of the product, in addition to the weight, power consumption and ease of use of the entire product. Whether it can meet consumer demand is also an important consideration.
Wang Wei said that the current MCU solution is mainly targeted at low-end and mid-level wearable devices, while MPU products are mainly locked into high-definition color screens and other more complex mid-to-high-end applications; such as Freescale's i.MX6 series. The MPU is launched for this need.
However, the current MPU program is still accepting whether it can truly meet the market demand test. Sharma believes that the declarative effect of the processor manufacturer's MPU solution is greater than the actual utility, mainly because the MPU solution will bring higher power consumption, which will cause the wearable device to be charged frequently. It will be difficult without a good supporting solution. Accepted by consumers; therefore, the core lab will not consider follow-up development of the Cortex-A series of processors in the short term, and will still focus on ultra-low power MCUs.
Despite this, the ApplicaTIon Processor (AP), which enables a higher performance mode of operation, is still on the market, especially in the field of smart glasses, which is expected to compete with the MCU solution.
0.8mm ( 0.031") Female Header Connector
Category:Board To Board Connectors
Sub-Category: Pin Header Female
Type:0.8mm
0.8mm ( 0.031") Female Headers Overview
Whenever there is a need for fitting small-sized connectors in compact devices, the 0.8mm pitch female header, or sometimes referred to as header connector, is ideally suited for this application. Not only does this female header space-savvy, but it is also designed for vacuum pick and place that makes it suitable for high volume automated manufacturing.
Antenk offers these low profile, easy-install, SMT or THM miniature female connector plugs at high quality and affordable China-quoted price, for board-to-board connection, snuggly fitting the pins of a Male Header and acting as a receptacle.
Assembly and service is simple with either vertical (straight), elevated or at a right angle configuration/orientation, which can dissipate current of about 1.0 A or less in a tape and reel packaging. The filleted corners can also remove shadowing allowing optimization of LED output.
Also, the 0.8mm pitch female headers are made to work in Arduino boards, Arduino Pro and Arduino Mega with either single or double-row female headers, facilitating connections for programming and incorporation into other circuits. They have the perfect height for clearing the USB-B connector and great for stacking multiple shields.
Female header always called as [Header connector", Antenk provide widely range of header connector, from 2.54mm (.100″ inch) pitch to 0.8mm (0.031 inch) pitch. The number of pins (contacts) is from 2 to 40 pins per orw. There are three type: Straight (Dip Vertical), Right angle, SMT (surface mount).
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Applications of 0.8mm Pitch Female Headers
Its small size is most suitable for PCB connections of small equipment and devices such as:
Arduino Boards
Architectural and sign lighting
Retail and display lighting
Fluorescent LED retrofit lighting
Cabinet or furniture lighting
Commercial / residential cove lighting
WiFi equipment
Gaming consoles,
Measurement instruments
Medical Diagnostic and Monitoring equipment
Communications: Telecoms and Datacoms
Industrial and Automotive Control and Test
Mount Type: Through-hole vs Surface Mount
At one side of this female header is a series of pins which can either be mounted and soldered directly onto the surface of the PCB (SMT) or placed into drilled holes on the PCB (THM).
Through-Hole (Poke-In)
Best used for high-reliability products that require stronger connections between layers.
Aerospace and military products are most likely to require this type of mounting as these products experience extreme accelerations, collisions, or high temperatures.
Useful in test and prototyping applications that sometimes require manual adjustments and replacements.
0.8mm vertical single row female header, 0.8mm vertical dual row female header, 0.8mm Elevated single row female header, 0.8mm Elevated dual row female Header, 0.8mm right-angle single row female header and 0.8mm right-angle dual row female header are some examples of Antenk products with through-hole mount type.
Surface-Mount
The most common electronic hardware requirements are SMT.
Essential in PCB design and manufacturing, having improved the quality and performance of PCBs overall.
Cost of processing and handling is reduced.
SMT components can be mounted on both side of the board.
Ability to fit a high number of small components on a PCB has allowed for much denser, higher performing, and smaller PCBs.
0.8mm Right-angle Dual Row female header, 0.8mm SMT Single row female header, 0.8mm SMT Dual row female header and 0.8mm Elevated Dual Row female Header are Antenk`s SMT female headers.
Soldering Temperature for 0.8mm Pitch Female Headers
Soldering SMT female connectors can be done at a maximum peak temperature of 260°C for maximum 60 seconds.
Orientation/Pin-Type: Vertical (Straight) and Right-Angle
0.8mm pitch female headers may be further classified into pin orientation as well, such as vertical or straight male header or right-angle female header.
Vertical or Straight Female Header Orientation
One side of the series of pins is connected to PCB board in which the pins can be at a right-angle to the PCB surface (usually called "straight" or [vertical") or.
Right-Angle Female Header Orientation
Parallel to the board's surface (referred to as "right-angle" pins).
Each of these pin-types have different applications that fit with their specific configuration.
Pcb Connector Stacking
Profile Above PCB
This type of configuration is the most common way of connecting board-to-board by a connector. First, the stacking height is calculated from one board to another and measured from the printed circuit board face to its highest insulator point above the PCB.
Elevated Sockets/Female Headers
Elevated Sockets aka Stacked sockets/receptacles or Mezzanine are simply stacked female headers providing an exact distance requirement between PCBs that optimizes electrical reliability and performance between PCB boards.
Choosing this type of stacking configuration promotes the following benefits:
Connector Isolation - the contacts are shrouded preventing cable connection mishaps and good guidance for the mating header connectors.
For off-the-shelf wireless PCB module, stacking height is optimized with elevated sockets.
Offers superior strength and rigidity.
Polarisation prevents users from inverted insertion.
Single, Dual or Multiple Number of Rows
For a 1.0mm straight or vertical female header, the standard number of rows that Antenk offers ranges from 1 to 2 rows. However, customization can be available if 3 ,4 or n number of rows is needed by the customer. Also, the number of contacts for the single row is about 2-40 pins while for dual row, the number contacts may vary from 2-80 pins.
Pin Material
The pins of the connector attached to the board have been designed with copper alloy. With customer`s demand the pins can be made gold plated.
Custom 1.0mm Pitch Female Headers
Customizable 1.0 mm pitch female headers are also available, making your manufacturing process way faster as the pins are already inserted in the headers, insulator height is made at the right size and the accurate pin length you require is followed.
Parts are made using semi-automated manufacturing processes that ensure both precision and delicacy in handling the headers before packaging on tape and reel.
Tape and Reel Packaging for SMT Components
Antenk's SMT headers are offered with customizable mating pin lengths, in which each series has multiple number of of circuits, summing up to a thousand individual part number combinations per connector series.
The tape and reel carrier strip ensures that the headers are packaged within accurately sized cavities for its height, width and depth, securing the headers from the environment and maintaining consistent position during transportation.
Antenk also offer a range of custom Tape and reel carrier strip packaging cavities.
Female Header Connector,0.8Mm Female Pin Header,0.8Mm Female Header,0.8Mm Pcb Header, Pitch 0.8mm Board to Board Connectors
ShenZhen Antenk Electronics Co,Ltd , https://www.antenk.com