According to foreign media reports, LSI has announced the launch of the 28nm custom chip platform. This platform takes full advantage of LSI's expertise in several generations of custom chips, enabling OEMs to build highly differentiated solutions to meet next-generation data centers and enterprises. And service provider network application requirements. It is reported that the 28nm custom chip platform uses TSMC 28HP (high-efficiency high dielectric layer metal gate) process technology, enabling customers to achieve unprecedented high SoC integration, significantly improve performance, and significantly reduce power consumption. At the same time, it also provides customers with a wealth of pre-certification options, including serializer/deserializer (SERDES), protocol solutions, high-performance high-density memory, 1000Base-T Ethernet physical layer, and ARM, MIPS, and PowerPC processing. Microprocessor support.
Industry experts say that today's network systems require differentiated hardware solutions to cope with rapidly growing traffic while meeting stringent power requirements. The custom chip platform enables OEMs to tailor hardware to customer requirements to meet their growing needs.
Compared to its predecessor technology, LSI has announced that the introduction of the 28nm design library will reduce power consumption by up to 40%, double the density, and improve performance by as much as 25%, enabling customers to meet performance requirements while reducing product costs and Refrigeration costs.
According to LSI, the 28nm platform design kit is available now. At present, many customers are developing the first batch of 28nm custom chip design solutions and are expected to provide samples in the near future.