2015 semiconductor packaging materials market will reach 25.7 billion US dollars

According to SEMI and TechSearch International's global semiconductor packaging materials outlook, the global semiconductor packaging materials market, including thermal interface materials, will reach US$22.8 billion in 2011, and will further grow to US$25.7 billion in 2015. Among them, laminated substrates still account for the largest proportion. The total amount for 2011 is estimated to be 9.7 billion U.S. dollars. Based on the number of units, the annual compound growth rate in the next five years will exceed 8%.

Packaging technology will continue to lead growth in the electronics industry and stimulate the miniaturization of portable electronic products. With the explosive demand for smart phones and flat-panel devices, the market recovery in 2010 and growth in 2011 were driven. Important growth areas in the packaging market include chip scale packages (CSP), laminates and leadframe based, stacked die, other 3-D packages, wafer level packages (wafers) -level packaging; WLP), power device packaging, LED packaging, and other system-in-package (SiP) form technologies.

Looking into the advanced packaging market, the market growth is still strong, including ball grid array (BGA), chip size (CSP, leadframe-based), flip chip, and wafer level package (WLP). ). These packages will have strong unit growth rates over the next four years, and many traditional packaging technologies will exhibit stagnation or single-digit growth.

"Global Semiconductor Packaging Materials Outlook: 2011/2012" market research report covers laminate substrates, flex circuit/tape substrates, leadframes, wire bonding, mold compounds (mold) Compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics, and thermal interfaces Thermal interface materials.

Increased use of certain new materials in the production of packaging processes has led to strong growth in parts including underfill materials, wafer-level dielectrics, copper bonding, chip size Construct other materials such as leadframe CSP.

This report conducts in-depth interviews with more than 140 packaging outsourcing factories, semiconductor manufacturers and material suppliers. The data in the report includes unpublished revenue data, component shipments and market share for various material markets, revenue estimates for five years (2011-2015), shipment estimates, average selling price estimates, and analysis of regional market trends, etc. content.