China's PV industry faces major changes

According to EnergyTrend, the financial crisis in 2008 once caused the highly energetic Chinese PV to fall to the bottom: Nearly 30% of domestic companies are on the brink of bankruptcy, and 70% of companies stop business, suspend production, or limit producti

TSMC enters the 18-inch wafer era at full speed

At the 2011 Technology Symposium held in California, USA, the company disclosed more details on the 18-inch wafer manufacturing plan. According to industry news, TSMC is advancing at full speed into the 18-inch wafer technology field. Its main purpose is to re

Anti-icing capacity of Guangxi Power Grid has significantly improved

Since 2008, the Guangxi Power Grid Company, in accordance with the General Secretary Hu Jintao's inspection in Guangxi, put forward the requirement of “focusing on perfecting the emergency management system mechanism, improving disaster prevention an

Meego Joins Tablet Wars

Meego Joins Tablet Wars The Intel Information Technology Summit 2011 was recently opened at the Beijing National Convention Center. At the conference, tablet PCs and Meego became the focus

High-power LED light radiator introduction

The so-called LED (short for Light-emitting Diode) lamp refers to a new type of environmentally friendly lighting product using semiconductor light-emitting diode technology as a light source. The LED lamp has the characteristics of energy saving, easy control, maintenance

CHIMEI launches new LED-backlit display

Recently, CHIMEI launched a new LED backlight display - light wing L series 24LH new machine, the new model has a unique 720 degree stereo color gamut, 2 millisecond speed response, ultra-thin beauty back mirror, ingenious star button design, not only performance It consumes a lot more than the

AOI technology

(1) If the solder paste printing process meets the requirements after solder paste printing, the number of defects discovered by AOI can be greatly reduced. Typical printing defects include the following:
A. Insufficient solder on the pad.
B. Too much solder on the p