Sony Chemical Showcases Conductive Adhesive for LED Flip Chip Packaging

Sony Chemicals exhibited the anisotropic conductive adhesive "LEP1000" for LED flip chip packaging at the recent lighting show. According to the company's personnel, when an anisotropic conductive adhesive commonly used for LSI or the like is used for an LED chip, the led stage lamp has a problem of discoloration due to heat and light, but the LEP1000 improves heat resistance and light resistance. The process of packaging an LED chip on a package substrate is simpler than ultrasonic bonding or the like. Currently, the company is introducing products to LED manufacturers and is scheduled to begin mass production in 2011.

At the company's booth, the brightness of LEDs that use the LEP1000 for flip-chip packaging of LED chips was compared to the brightness of LEDs that packaged LED chips with wire bonding. According to the company, the luminous flux when the LED chip is packaged by a wire bonding method on a gold-plated conductor is 100 lm, and the silver-plated conductor that can easily extract light is 155 lm. If the LEP1000 is used, a luminous flux of 155 lm can be obtained even if a gold-plated conductor is used.

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